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  3. Thermal Management Materials for Electronic Packaging: Preparation, Characterization, and Devices

Thermal Management Materials for Electronic Packaging: Preparation, Characterization, and Devices

Xingyou Tian (editor), 3527352422, 9783527352425

10 $

English | 2023 | PDF

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Thermal Management Materials for Electronic Packaging: Preparation, Characterization, and Devices